Mechanic Heat Kit Thermostat Remove Welding Platform Desoldering Heater For iPhone 11-13 Pro Max Motherboard Mid-Frame Separator
Features:
Reflow soldering heating platform, 5 professional mode selection, 3 common mode operation
Especially for the original solder of mobile phone motherboard, curve heating, intelligent and safe desoldering and reflow
The traditional single heating element is banned, and the new MCH ceramic double heating element is adopted, which has faster heating, more uniform temperature, and stable performance
5 application scene modes of degumming, layering, lamination, tin planting, and welding can be switched arbitrarily
3 commonly used memory temperatures, automatic recording of the current temperature (save when power is off) and manual recording of the current temperature mode
Turbofan blades for heat dissipation, built-in strong wind cooling system, the fan adapts the speed according to the temperature to dissipate heat
Monitor temperature changes and realize reflow soldering temperature curve data monitoring
Real-time detection of motherboard heating and cooling temperature, no need to switch interface to view
Scope of application: For iPhone X/XS/XS Max/11/11 Pro/11Pro Max/12 Mini/12/ 12 Pro/12Pro Max/13 Mini/13/13 Pro/13Pro Max
Key Description:
"Add button" click to adjust the temperature, long press to start heating
"Minus key" click to adjust the temperature, long press to start cooling
"MEM key" click to switch three temperature memory, long press to set the memory temperature
"SET button" click to switch five modes, long press to set the mode temperature
Package includes:
1 x Host
1 x Power Cord
6 x Modules
12 x Steel mesh
